A temporary package for a semiconductor die is provided. The temporary package has an outline and external contact configuration that are the same as a conventional plastic or ceramic semiconductor package. The temporary package can be used for burn-in testing of the die using standard equipment. The...http://www.google.fr/patents/US6094058?utm_source=gb-gplus-shareBrevet US6094058 - Temporary semiconductor package having dense array external contacts
Temporary semiconductor package having dense array external contacts
