In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring...http://www.google.fr/patents/US7817437?utm_source=gb-gplus-shareBrevet US7817437 - Semiconductor device
