A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions...http://www.google.fr/patents/US20040212969?utm_source=gb-gplus-shareBrevet US20040212969 - Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
Circuit board and method for manufacturing the same and semiconductor device ...
Numéro de demande: 10/833,972 Numéro de publication: US 2004/0212969 A1 Date de dépôt: 27 avr. 2004 Brevet délivré: US7285734 ( Date de délivrance 23 oct. 2007)
