A package structure with an embedded capacitor, a fabricating process thereof and applications of the same are provided, wherein the package structure includes a dielectric layer, a first conductive layer, a second conductive layer, a first embedded plate and a second embedded plate. The dielectric layer...http://www.google.fr/patents/US20080180878?utm_source=gb-gplus-shareBrevet US20080180878 - PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME
PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND ...
