A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic...http://www.google.fr/patents/US7298046?utm_source=gb-gplus-shareBrevet US7298046 - Semiconductor package having non-ceramic based window frame
Semiconductor package having non-ceramic based window frame
