A semiconductor device includes a semiconductor substrate having a plurality of connecting pads on one surface, an insulating film formed on one surface of the semiconductor substrate. The insulating film has holes each corresponding to one of the connecting pads, and a recess having a bottom surface...http://www.google.fr/patents/US20040094841?utm_source=gb-gplus-shareBrevet US20040094841 - Wiring structure on semiconductor substrate and method of fabricating the same
Wiring structure on semiconductor substrate and method of fabricating the same
Numéro de demande: 10/700,136 Numéro de publication: US 2004/0094841 A1 Date de dépôt: 3 nov. 2003 Brevet délivré: US7285867 ( Date de délivrance 23 oct. 2007)
