At least one chip type component is soldered to a printed circuit board by independent first and second nozzles which spout molten solder so as to form respective first and second solder waves, with the printed circuit board sequentially passed through the first and second nozzles. The first and second...http://www.google.fr/patents/US4824010?utm_source=gb-gplus-shareBrevet US4824010 - Process and apparatus for soldering printed circuit boards
Process and apparatus for soldering printed circuit boards
