A vacuum chuck for holding a semiconductor wafer during high pressure processing comprises a wafer platen, first through third lift pins, and an actuator mechanism. The wafer platen comprises a smooth surface, first through third lift pin holes, and a vacuum opening. In use, the vacuum opening applies...http://www.google.fr/patents/US6722642?utm_source=gb-gplus-shareBrevet US6722642 - High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
High pressure compatible vacuum chuck for semiconductor wafer including lift ...
