A BOC (board-on-chip) semiconductor package includes a semiconductor die having die contacts, a substrate bonded circuit side down to the die, and an adhesive layer bonding the substrate to the die. The substrate includes a circuit side having a pattern of conductors and wire bonding sites, and a back...http://www.google.fr/patents/US20020102831?utm_source=gb-gplus-shareBrevet US20020102831 - Method for fabricating BOC semiconductor package
Numéro de demande: 10/047,903 Numéro de publication: US 2002/0102831 A1 Date de dépôt: 17 janv. 2002 Brevet délivré: US6638792 ( Date de délivrance 28 oct. 2003)
