Large capacity memory systems are constructed using stacked memory integrated circuits or chips. The stacked memory chips are constructed in such a way that eliminates problems such as signal integrity while still meeting current and future memory standards....http://www.google.fr/patents/US20100020585?utm_source=gb-gplus-shareBrevet US20100020585 - METHODS AND APPARATUS OF STACKING DRAMS
Numéro de demande: 12/574,628 Numéro de publication: US 2010/0020585 A1 Date de dépôt: 6 oct. 2009 Brevet délivré: US8213205 ( Date de délivrance 3 juil. 2012)
