Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive...http://www.google.fr/patents/US20030190426?utm_source=gb-gplus-shareBrevet US20030190426 - Electroless deposition method
