A microelectronic assembly, and method of making the same, including a wire stitch bonded on an electroplated gold bump or electroless nickel/gold bump on a bond pad of an integrated circuit chip. The electroplated gold bump or electroless nickel/gold bump provides a relatively flat upper surface which...http://www.google.fr/patents/US6787926?utm_source=gb-gplus-shareBrevet US6787926 - Wire stitch bond on an integrated circuit bond pad and method of making the same
Wire stitch bond on an integrated circuit bond pad and method of making the same
