The present invention provides systems, methods and apparatus for high temperature (at least about 500-800 C.) processing of semiconductor wafers. The systems, methods and apparatus of the present invention allow multiple process steps to be performed in situ in the same chamber to reduce total processing...http://www.google.fr/patents/US6347636?utm_source=gb-gplus-shareBrevet US6347636 - Methods and apparatus for gettering fluorine from chamber material surfaces
Methods and apparatus for gettering fluorine from chamber material surfaces
