A method of forming openings on a semiconductor wafer comprising an initial step of providing a first film layer over the semiconductor wafer. A first opening in the first film layer is created by transferring an image of the first opening from a photoresist layer into the first film layer using an etching...http://www.google.fr/patents/US6660456?utm_source=gb-gplus-shareBrevet US6660456 - Technique for the size reduction of vias and other images in semiconductor chips
Technique for the size reduction of vias and other images in semiconductor chips
