A burn-in frame having at least one window and including resistors having resistor pads is situated on a flexible layer, and at least one integrated circuit chip having chip pads is situated in the at least one window. Via openings are formed in the flexible layer to extend to the chip pads and the resistor...http://www.google.fr/patents/US5888837?utm_source=gb-gplus-shareBrevet US5888837 - Chip burn-in and test structure and method
