A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends...http://www.google.fr/patents/US5410451?utm_source=gb-gplus-shareBrevet US5410451 - Location and standoff pins for chip on tape
