The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity...http://www.google.fr/patents/US20060027523?utm_source=gb-gplus-shareBrevet US20060027523 - Micromachined fluidic device and method for making same
Micromachined fluidic device and method for making same
Numéro de demande: 11/235,713 Numéro de publication: US 2006/0027523 A1 Date de dépôt: 26 sept. 2005 Brevet délivré: US7311503 ( Date de délivrance 25 déc. 2007)
