A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium...http://www.google.fr/patents/US6329721?utm_source=gb-gplus-shareBrevet US6329721 - Pb-In-Sn tall C-4 for fatigue enhancement
