A method for forming an interconnect for establishing electrical communication with a semiconductor die is provided. The method includes: providing a microbump tape and then mounting the tape to a substrate with a compliant layer therebetween. The microbump tape includes an insulating film having a pattern...http://www.google.fr/patents/US5915755?utm_source=gb-gplus-shareBrevet US5915755 - Method for forming an interconnect for testing unpackaged semiconductor dice
Method for forming an interconnect for testing unpackaged semiconductor dice
