A multichip mounted structure has a substrate 11 provided with substrate-side terminals 16a and 16b and a plurality of IC chips 12a and 12b provided with bumps 14a and 14b, respectively, so that the substrate-side terminals 16a and 16b are conductively connected with the bumps 14a and 14b, respectively....http://www.google.fr/patents/US6775149?utm_source=gb-gplus-shareBrevet US6775149 - Multichip mounted structure, electro-optical apparatus, and electronic apparatus
Multichip mounted structure, electro-optical apparatus, and electronic apparatus
