A solid filler material is used to encapsulate active TFEL components supported by a substrate and disposed within a cavity. The cavity is created by affixing a rear cover plate to the substrate. The filler material is injected into the cavity as a liquid but cures to a solid under the influence of heat....http://www.google.fr/patents/US4802873?utm_source=gb-gplus-shareBrevet US4802873 - Method of encapsulating TFEL panels with a curable resin
Method of encapsulating TFEL panels with a curable resin
