A dual-position magnetron that is rotated about a central axis in back of a sputtering target, particularly for sputtering an edge of a target of a barrier material onto a wafer and cleaning material redeposited at a center of the target. During target cleaning, wafer bias is reduced. In one embodiment,...http://www.google.fr/patents/US20050211548?utm_source=gb-gplus-shareBrevet US20050211548 - Selectable dual position magnetron
Numéro de demande: 10/949,735 Numéro de publication: US 2005/0211548 A1 Date de dépôt: 23 sept. 2004 Brevet délivré: US7018515 ( Date de délivrance 28 mars 2006)
