A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller...http://www.google.fr/patents/US7846006?utm_source=gb-gplus-shareBrevet US7846006 - Dressing a wafer polishing pad
