Methods and structures are described to provide trims for die on a wafer. The trims are set on a die-by-die basis instead of a wafer basis. Accordingly, the individual die are more finely tuned and more die operate at the target specifications so that yield is increased. In an embodiment, the odd and...http://www.google.fr/patents/US7512507?utm_source=gb-gplus-shareBrevet US7512507 - Die based trimming
