In a solid state image sensor having micro lenses, the micro lens and a bonding pad electrode are formed on a planarizing layer. Thus, it is no longer necessary to etch the planarizing layer for exposing the bonding pad under the planarizing layer, by use of a photolithography, and therefore, it is possible...http://www.google.fr/patents/US6472698?utm_source=gb-gplus-shareBrevet US6472698 - Solid state image sensor and method for fabricating the same
Solid state image sensor and method for fabricating the same
