In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC (in flip-chip connection to a package substrate) and other ICs (in non-flip chip orientation),...http://www.google.fr/patents/US8097956?utm_source=gb-gplus-shareBrevet US8097956 - Flexible packaging for chip-on-chip and package-on-package technologies
Flexible packaging for chip-on-chip and package-on-package technologies
