Principal faces of semiconductor devices (19) are bonded by means of a bond layer (17) on one face (lower face) of a heat-resistive flexible synthetic resin film (8, 16), for example, polyimide film, the other face (upper face) of the heat-resistive flexible synthetic resin film (8, 16) has bonded wiring...http://www.google.fr/patents/US4356374?utm_source=gb-gplus-shareBrevet US4356374 - Electronics circuit device and method of making the same
Electronics circuit device and method of making the same
