A method is for manufacturing a microstructure having a thin-walled portion with use of a material substrate. The material substrate has a laminated structure which includes a first conductor layer 101, a second conductor layer 102, a third conductor layer 103, a first insulating layer 104 interposed...http://www.google.fr/patents/US7033515?utm_source=gb-gplus-shareBrevet US7033515 - Method for manufacturing microstructure
