A semiconductor device comprising a first electrically conductive layer formed on a semiconductor element or on one main surface of a semiconductor substrate, an insulating layer formed on said first electrically conductive layer through which a connection hole of which diameter is the smallest in a...http://www.google.fr/patents/US6002175?utm_source=gb-gplus-shareBrevet US6002175 - Semiconductor device with improved connection hole for embedding an electrically conductive layer portion
Semiconductor device with improved connection hole for embedding an ...
