A method for detecting the endpoint for removal of a target film overlying a stopping film by chemical-mechanical polishing using a slurry, by removing the target film with a polishing process that generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in...http://www.google.fr/patents/US6228280?utm_source=gb-gplus-shareBrevet US6228280 - Endpoint detection by chemical reaction and reagent
Endpoint detection by chemical reaction and reagent
