A preferred embodiment of this invention comprises an oxidizable layer (e.g. tantalum 48), an oxygen gettering layer (e.g. platinum/tantalum mixture 34) overlaying the oxidizable layer, a noble metal layer (e.g. platinum 36) overlaying the oxygen gettering layer, and a high-dielectric-constant material...http://www.google.fr/patents/US5348894?utm_source=gb-gplus-shareBrevet US5348894 - Method of forming electrical connections to high dielectric constant materials
Method of forming electrical connections to high dielectric constant materials
