There are provided a method of producing an SOI wafer of high quality with excellent controllability, productivity and economy and a wafer produced by such a method. In the method of producing a substrate utilizing wafer bonding, a first substrate member and a second substrate member are mutually bonded,...http://www.google.fr/patents/US6569748?utm_source=gb-gplus-shareBrevet US6569748 - Substrate and production method thereof
