A method and apparatus is provided for filling apertures formed in a substrate surface by depositing materials that selectively inhibit or limit the formation or growth of subsequent layers used to fill an aperture. In one aspect, a method is provided for processing a substrate including providing a...http://www.google.fr/patents/US6797620?utm_source=gb-gplus-shareBrevet US6797620 - Method and apparatus for improved electroplating fill of an aperture
Method and apparatus for improved electroplating fill of an aperture
