The present invention provides a vacuum deposited metal layer that can shield the electronic components on a PCB or FPC. The vacuum metallized conductive layer can be grounded to a ground trace on the circuit board to create a Faraday cage to protect the electronic components disposed on the circuit...http://www.google.fr/patents/US20010033478?utm_source=gb-gplus-shareBrevet US20010033478 - EMI and RFI shielding for printed circuit boards
