A chip scale package, which can be fabricated on a print circuit board, comprises a chip having multiple electrodes, a plurality of conductive blocks, and an insulating material. The electrodes of the chip are electrically connected to the conductive blocks respectively through one of the surfaces thereof...http://www.google.fr/patents/US6392305?utm_source=gb-gplus-shareBrevet US6392305 - Chip scale package of semiconductor
