Planarizing machines, planarizing pads, and methods for planarizing or endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrates. One particular embodiment is a planarizing machine that controls the movement of a planarizing pad along a pad travel path to provide optical...http://www.google.fr/patents/US20050266773?utm_source=gb-gplus-shareBrevet US20050266773 - Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
Apparatuses and methods for in-situ optical endpointing on web-format ...
Numéro de demande: 11/197,287 Numéro de publication: US 2005/0266773 A1 Date de dépôt: 3 août 2005 Brevet délivré: US7229338 ( Date de délivrance 12 juin 2007)
