A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to...http://www.google.fr/patents/US6354917?utm_source=gb-gplus-shareBrevet US6354917 - Method of processing a wafer utilizing a processing slurry
Method of processing a wafer utilizing a processing slurry
