In a semiconductor device and a method for manufacturing the same according to the present invention, each of electrode pads on a semiconductor chip is bonded to an inner lead section of each of leads of a carrier tape by a connecting electrode. An insulating film of the carrier tape is then adhered...http://www.google.fr/patents/US5612259?utm_source=gb-gplus-shareBrevet US5612259 - Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame
Method for manufacturing a semiconductor device wherein a semiconductor chip ...
