A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable...http://www.google.fr/patents/US20070182020?utm_source=gb-gplus-shareBrevet US20070182020 - CHIP CONNECTOR
