A universal substrate includes an input/output (I/O) layer having a fixed I/O assignment of I/O locations for connection with a printed circuit board or the like. A chip receiving layer is provided for receiving one of at least two different but allied semiconductor chips, wherein each of the at least...http://www.google.fr/patents/US5946552?utm_source=gb-gplus-shareBrevet US5946552 - Universal cost reduced substrate structure method and apparatus
Universal cost reduced substrate structure method and apparatus
