Microelectronic devices having intermediate contacts, and associated methods of packaging microelectronic devices with intermediate contacts, are disclosed herein. A packaged microelectronic device configured in accordance with one embodiment of the invention includes a microelectronic die attached to...http://www.google.fr/patents/US20070045872?utm_source=gb-gplus-shareBrevet US20070045872 - Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
Microelectronic devices having intermediate contacts for connection to ...
Numéro de demande: 11/217,629 Numéro de publication: US 2007/0045872 A1 Date de dépôt: 31 août 2005 Brevet délivré: US7745944 ( Date de délivrance 29 juin 2010)
