A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach region. The die attach region includes...http://www.google.fr/patents/US6867481?utm_source=gb-gplus-shareBrevet US6867481 - Lead frame structure with aperture or groove for flip chip in a leaded molded package
Lead frame structure with aperture or groove for flip chip in a leaded ...
