In a multilayer printed-circuit substrate comprising a plurality of insulating resin layers, a plurality of metal-made electrically conductive circuits respectively laminated between the insulating resin layers and on the upper surface of the uppermost-positioned insulating resin layer and electrically...http://www.google.fr/patents/US5633069?utm_source=gb-gplus-shareBrevet US5633069 - Multilayer printed-circuit substrate, wiring substrate and process of producing the same
Multilayer printed-circuit substrate, wiring substrate and process of ...
