An apparatus and method for wafer level fabrication of high value inductors directly on top of semiconductor integrated circuits. The apparatus and method includes fabricating a semiconductor wafer including a plurality of dice, each of the dice including power circuitry and a switching node. Once the...http://www.google.fr/patents/US7829425?utm_source=gb-gplus-shareBrevet US7829425 - Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits
Apparatus and method for wafer level fabrication of high value inductors on ...
