The present invention features a process and a resulting article in which copper-based multilevel interconnects are fabricated. The copper-based multilevel interconnect formed by the inventive process first includes the process step of depositing a pattern of copper lines upon or in an applicable substrate,...http://www.google.fr/patents/US5310602?utm_source=gb-gplus-shareBrevet US5310602 - Self-aligned process for capping copper lines
