A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image...http://www.google.fr/patents/US20060193506?utm_source=gb-gplus-shareBrevet US20060193506 - Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
Method and apparatus for detecting defects in wafers including alignment of ...
Numéro de demande: 11/068,711 Numéro de publication: US 2006/0193506 A1 Date de dépôt: 28 févr. 2005 Brevet délivré: US7804993 ( Date de délivrance 28 sept. 2010)
