A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate...http://www.google.fr/patents/US7534660?utm_source=gb-gplus-shareBrevet US7534660 - Methods for assembly and packaging of flip chip configured dice with interposer
Methods for assembly and packaging of flip chip configured dice with interposer
