A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer...http://www.google.fr/patents/US5834880?utm_source=gb-gplus-shareBrevet US5834880 - Multilayer array ultrasonic transducers
