A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy current monitoring system is positioned...http://www.google.fr/patents/US7008297?utm_source=gb-gplus-shareBrevet US7008297 - Combined eddy current sensing and optical monitoring for chemical mechanical polishing
Combined eddy current sensing and optical monitoring for chemical mechanical ...
