A flip chip type quad flat non-leaded package, comprising: a plurality of leads each having a first surface and a second surface opposite to the first surface; a die having an active surface and a backside opposite the active surface, wherein the active surface has a plurality of bonding pads, each having...http://www.google.fr/patents/US6507120?utm_source=gb-gplus-shareBrevet US6507120 - Flip chip type quad flat non-leaded package
